SMT Equipments (Pick-and-Place, Solder Paste Screen Printer, Reflow Oven, Curing / Baking Oven, Repair and Inspection)
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In SMT or Surface Mount Assemblies (all Three Types of Surface Mount – Type I, II, and III) have three major process steps in common: mounting of electronic components, soldering, and cleaning.
A complete through-hole process and a surface mount process have nothing in common.
Following equipments are required for any SMT production line:
Solder paste printer
THM Inserter
SMD Placer
Adhesive Cure Oven
Reflow Oven
Cleaner
Wave Solder
Below, I discuss in detail, SMT equipments requiring major capital.
Pick-and-Place Machine for SMT
Pick-and-Place machine is the heart of surface mount. A pick-and-place machine picks and places electronic components onto the PCB prior to soldering.
Pick-and-Place machines use vacuum pickup tools to hold the components. Few others also use vision-assisted alignment. In general, pick-and-place machines offer better speed, accuracy, and flexibility than through-hole insertion machines.
Read:
Pick-and-Place Machine for SMT
Solder Paste Screen Printer for SMT
A Solder Paste Screen Printer for SMT is needed to screen solder paste onto the printed circuit board (PCB) before placement of surface mount components.
Solder Paste Printing Systems are available in three configurations: manual, semi-automatic and fully automatic. The machine can be table mounted, stand-alone, or in-line. Read: Solder Paste Screen Printer for SMT
Reflow Soldering Equipment for SMT
There are many reflow soldering methods and each method has advantages and disadvantages.
The most widely used reflow processes in electronics are: vapor phase and infrared. A reflow soldering equipment / machine is the second major equipment after pick-and-place machine in any SMT line. Read: Reflow Soldering Equipment for SMT
Curing / Baking Oven for SMT
In electronics, an oven is required for both adhesive curing and solder paste baking operations. The same or different ovens may be used for adhesive curing and baking of solder paste. If an Infrared (IR) oven or a convection oven is used for reflow soldering, it is not necessary to have separate adhesive and solder paste baking ovens. The same IR or convection oven can be used for adhesive curing, solder paste baking, and reflow soldering.
Wave Soldering Equipment
The need for wave soldering equipment can also be met by simply retrofitting the conventional solder pot with the dual pot – at a small fraction of the cost of a new machine. A completely new machine is not necessary in SMT.
Read: Wave Soldering Equipment
Solvent Cleaning in SMT
In SMT, the cleaning process has received considerable attention because of efforts to eliminate chlorofluorocarbons (CFCs) and other ozone depleting chemicals.
The subjects of flux, solder and cleaning are closely intertwined. The selection of solvent and cleaning equipment depends of the flux used and the cleanliness requirements. Read: Solvent Cleaning in SMT
Repair and Inspection Equipment for SMT
Equipment unique to surface mounting includes inspection and repair / rework equipment.
There are two main types of automated inspection equipment for SMT on the market: x-ray and laser. Repair / Rework equipment include: conductive tips or hot air for removal and replacement of components, conductive tips with built-in heating elements, hot air repair / rework tools. Read: Repair and Inspection Equipment for SMT
SMT Equipment
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