Soldering: Metallurgy and Solderability

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By guidebaba


The metallurgy of soldering is the key to understanding the mechanisms of intermetallic formation and solderability testing. A basic knowledge of phase diagrams of the metals used in soldering permits one to determine the solubility of one metal in another. The solubility controls important variables such as alloy composition, melting point for soldering, and occurrence of leaching.

Tin-lead solder is the most commonly used solder for electronic assembly. However, the known health hazards of lead have caused the industry to look into solders that do not contain lead (Lead Free Solder). However, none of the lead-free solders now available can be used as a drop-in replacement for tin-lead eutectic.



Soldering
Soldering

There is general agreement that for successful soldering results, components and boards must have good solderability. Now the industry has settled on common standards for solderability test methods and requirements.

The lead finish not only plays a key role in solderability but also has an impact on Coplanarity in active devices and component placement in passive devices. To control the solderability of printed circuit boards or electronic components, one must not only have adequate solder thickness but the thickness should also be uniform and continuous.

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