- Materials & Industrial Technology
The ANSI J-Standard List
The ANSI J-STD list contains joint standards shared by the Electronic Industries Alliance (EIA), Institute for Interconnecting and Packaging Electronic Circuits (IPC) and ANSI International.
These J-STD standards outline the material specifications, test methods, performance requirements and visual inspection criteria for soldered components and connections in electronics. Circuit cards built to the J-standards are inspected according to the IPC-A-610 standard.
J-STD-001 is the joint industrial standard requirement for soldered electrical components and soldered electronic assemblies. J-STD-001 describes allowed soldering techniques. J-STD-001 gives the required level of cleanliness for solder joints, such as the amount of foreign object debris or FOD and other types of residue.
J-STD-001DS is an addendum to J-STD-001E is the 2010 version of the J-STD-001 standard. J-STD-001DS that applies to soldered electronic components used in aerospace products.
J-STD-002 is the standard for solderability tests for component leads, terminations and wires. J-STD-002C is the version of J-STD-002 that was published in 2008.
To prepare specimens for solderability testing under J-STD-002, specimens sit in a steam chamber. They may sit there for one hour or eight, but are set for a high level of humidity. Solderability testing is done using wet balance tests and dip-and-look tests. J-STD-002 does not include competing solder testing methods such as the globule solderability test, spread test or twisted pair test.
J-STD-003 is the joint industrial standard for the solderability testing of printed wiring boards. Solderability is the measure of how well a solder joint is made between the component such as a wire and the circuit board is made.
J-STD-003 outlines the test methods for determining the solderability of PWBs or printed wiring boards and printed circuit card assemblies. J-STD-003 describes methods of testing the solderability of plated through holes and attachment lands on PWBs. This standard outlines the types of defects quality control personnel should look for like voids in plated through holes and solder that did not adhere to the board. Solderability tests differ for tin-lead solder and lead-free solder. Tests A through E apply to tin/lead solder. Tests A1 through E1 apply to assemblies with lead-free solder.
J-STD-003 was published in April, 1992. Version J-STD-003A was published in 2003. J-STD-003B was released in 2007.
Fluxes are used to condition a surface before the soldering process. J-STD-004 covers fluxes like rosin fluxes and liquid solder flux. J-STD-004 gives the joint industrial standards and performance requirements for soldering fluxes. The tests in J-STD-004 include visual inspection, viscosity testing, corrosion testing and performance testing.
There are solder flux tests that are optional under J-STD-004, such as the qualitative halide test, SIR tests and measurements of the resistance of the solder flux to fungus.
J-STD-004 was published in 1995. Version J-STD-004A was published in 2004.
J-STD-005 gives the joint industrial requirements for soldering pastes. The requirements for soldering paste include its chemical composition, its melting point, its viscosity and cohesion. Version J-STD-005A was published in 2012.
J-STD-006 is the standard for solder alloys such as fluxed bar solder and powder solder. J-STD-006 specifies the test methods used for solder alloys used for electronics; solder alloys used for other applications fall under ASTM standards.J-STD-006 is a standard for the quality of the solder, not its material specifications.
J-STD-006B is the 2009 version of J-STD-006.
IPC-A-610 and Its Relationship to the J-Standards
The J-standards are IPC standards for the materials, production methods and general inspection of circuit card assemblies. A closely related IPC standard is IPC-A-610. Called the “Acceptability of Electronic Assemblies” standard, it outlines the acceptance criteria for printed circuit boards, regardless of their manufacturer or intended purpose.
According to IPC’s website, IPC-A-610 is its most widely published standard and has been translated into several languages. IPC-A-610 revision E or IPC 610 E was published in 2010. Circuit card assemblies built according to IPC J-standards are usually inspected in accordance with the IPC-A-610 standard.
International Versions of J-STD
Chinese versions of the J-STD list are noted with a –CN. For example, J-STD-005-CN is the Chinese version of J-STD-005. Japanese versions of these joint solder standards are –JP. For example, J-STD-005-JP is the Japanese version of J-STD-005.